HotLok Rack Airflow Management (RAM) Kit
Reduces Bypass Airflow & Recirculation in Rack Enclosures
The HotLok Rack Airflow Management (RAM) Kit is designed to seal the gaps between the rail and side of rack enclosures, helping to reduce bypass airflow and recirculation in your rack enclosures.
Whilst HotLok blanking panels reduce the hot air recirculation in unused rack space, hot air has still been able to mix with the cold air at the front of the rack through the unsealed area between the rails and the sides of the rack. The HotLok Rack Airflow Management (RAM) Kit addresses this issue and greatly improves the effectiveness and efficiency of your cooling infrastructure.
RAM Kit Sealing Effectiveness
The Rack Airflow Management Kit is designed as an effective tool for sealing airflow between the rail and side of cabinet while also isolating exhaust air at the rear of the cabinet. The “RAM Kit” compliments blanking panels and completes the job of sealing your cabinet. The Mounting Extrusion is made from Rigid PVC, the Sealing Membrane from Flexible PVC with a matte black finish.